Overview
Equipment Engineer Jobs in Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia at NXP Semiconductors
Title: Equipment Engineer
Company: NXP Semiconductors
Location: Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia
- ATKL Packing Material Coordinator, accountable to drive total ATKL packing cost implementation, packing material standardization and packing quality across
- Work collaboratively with equipment, manufacturing & supplier to improve packing quality related
- LeadTBE NPI for packing related and ensure timely execution.
- Lead or need to update SOP, SWE,OCAP, FMEA, Control plan related to packing process
- Packing qualification (tray, carrier tape, cover tape, desiccant, hic, box, bubble wrap)
- Update packing method changed in APL system
- Packing material submission updating ( Enovia, Beeline, GMDM & MMPR)
- APL full development and implementation
- SOP, SWE,OCAP, FMEA, Control plan related to packing process
- New item submit in MMPR GMDM for General Store ordering
- Work with supplier on daily packing related issue.(ITW- Richard, CPAK- Sam DY on quality)
additional requirement
- Educational background : Engineering Degree (Electronics or Mechanical or Mechatronics or Chemical)
- Preferred working experience in semiconductor manufacturing and vision inspection.
- Speedy, Multi-tasking, results-orientated and able to work in fast phase manufacturing environment.
- Open-minded, willing to accept new challenges and overcome it with positive attitude.
- Motivated team player with high level of ownership.
- Able to communicate with all levels of people.
- Knowledge/experience in programming language a plus.
More information about NXP in Malaysia…
