Overview
Packaging Development Engineer Jobs in Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia at NXP Semiconductors
Title: Packaging Development Engineer
Company: NXP Semiconductors
Location: Kuala Lumpur, Federal Territory of Kuala Lumpur, Malaysia
Responsibilities
- Lead, plan, and execute projects related to process assembly development and validation
- Design, execute, and analyze process related experiments
- Use software to analyze data including statistical analysis
- Solve process issues using creative problem solving techniques
- Create process recipe for packaging development, qualify and transfer for high volume production
- Set up new specifications and procedures for production
- Initiate sharing of lesson learnt and best practices among manufacturing sites
- Lead / participate in Task Force Teams
- Identify risks and actions for risk mitigation manufacturing operation
- Lead / support process qualification activities
Requirements
- Minimum Bachelor’s degree in Engineering or Sciences (or related field). Master or PhD holder is preferred.
- Good aptitude in statistical data analysis and problem solving skills
- Must exhibit pro-activeness in leading process characterization work, ability to take on new challenges an embrace changes
- Basic knowledge of project planning and experience in driving small projects
- Excellent communication and presentation skills
- Must demonstrate good initiative, collaboration, and interpersonal skills working with cross functional teams
- Must be committed to meet process / project deadlines and commitments
More information about NXP in Malaysia…
